images
Kaynote Speaker

Tony Q.S. Quek

IEEE Fellow, WWRF Fellow
Fellow of Academy of Engineering Singapore
Associate Provost (AI & Digital Innovation)
Cheng Tsang Man Chair Professor
ST Engineering Distinguished Professor
Director, Future Comms R&D Programme
Singapore University of Technology and Design

Bios

Tony Q.S. Quek received the B.E. and M.E. degrees in Electrical and Electronics Engineering from Tokyo Institute of Technology, respectively. At Massachusetts Institute of Technology, he earned the Ph.D. in Electrical Engineering and Computer Science. Currently, he is the Associate Provost (AI & Digital Innovation) and Cheng Tsang Man Chair Professor with Singapore University of Technology and Design (SUTD). He also serves as the Director of the Future Communications R&D Programme, and the ST Engineering Distinguished Professor. He is a co-founder of Silence Laboratories, NeuroRAN, and DN-RAN. His current research topics include wireless communications and networking, network intelligence, non-terrestrial networks, open radio access network, AI-RAN, and 6G.

Dr. Quek received the 2008 Philip Yeo Prize for Outstanding Achievement in Research, the 2012 IEEE William R. Bennett Prize, the 2016 IEEE Signal Processing Society Young Author Best Paper Award, the 2017 CTTC Early Achievement Award, the 2017 IEEE ComSoc AP Outstanding Paper Award, the 2020 IEEE Communications Society Young Author Best Paper Award, the 2020 IEEE Stephen O. Rice Prize, the 2020 Nokia Visiting Professorship, the 2022 IEEE Signal Processing Society Best Paper Award, the 2024 IIT Bombay International Award For Excellence in Research in Engineering and Technology, the IEEE Communications Society WTC Recognition Award 2024, and the Public Administration Medal (Bronze). He is an IEEE Fellow, a WWRF Fellow, an AIIA Fellow, a member of NAAI, and a Fellow of the Academy of Engineering Singapore.

Conference Begins
Oct. 28 – Nov. 1, 2026

Important Dates

Submission deadline:
Jun. 15, 2026
Acceptance notification:
Aug. 20, 2026
Camera-ready paper:
Sept. 25, 2026
Presentation submission:
Oct. 13, 2026

Organizer

Technical co-sponsors

Sponsor